Academicsera – 586th International Conference On Electrical and Electronics Engineering(ICEEE), 14-15 December 2019, Shanghai, China
Academicsera is formed to carry on the business of promoting, forming, developing and organizing associations and networks of Chemical, Petroleum, Physics, Biology, Civil, Mechanical, Medical, Dental, Computer, Electronics, Electrical, Management, Biomedical, Bioinformatics, Bio-Technology, Aeronautical, Textile, Environmental and all related Doctors, Engineers and Professionals who are in the field of innovation; and to conduct, promote and organize Meetings, Conference, Discussions, Seminars, Workshops, Study tours, Industry visits; and to publish professional Journals, Magazines and Newsletters; and to carry on research and development on the above fields; and to design, develop, market, purchase, sell, import and export any products or materials of any above Medical, Science and Engineering field.
The Academicsera is organizing the 586th International Conference on Electrical and Electronics Engineering on 14th and 15th of December. The event is going to held in Shangai, the biggest and most prosperous city of China. The conference is planned with the motive to bring together innovative academics and industrial experts in the field of Science Technology and Management to a common forum. The conference provides a common interactive platform for all the researchers and practitioners to interact and gain ideas and innovation from global experts. In addition to that, the conference fosters the relationship and communication between researchers, experts, and industrial heads for potential future collaboration.
The academic conference would offer a large number of invited lectures from renowned speakers all over the country. Best paper awards will be given for the papers judged to make the most significant contribution to the conference. All the registered papers will be published by the World Research Library and will be submitted for review for indexing by Google Scholar etc. All submissions to the conference will be reviewed by at least two independent peers for technical merit and content. It is anticipated that a broad range of research and applied topics will be covered during the conference.