Young Leaders of the Americas Initiative (YLAI) Outbound Exchange Program 2025

The YLAI Outbound Exchange Program is sponsored by the U.S. Department of State with funding provided by the U.S. Government and supported in its implementation by the YLAI Team at IREX.

The Outbound Exchange aims to build upon emerging business partnerships and professional connections established during the 2024 YLAI Fellowship by fostering sustained collaboration, learning, and capacity building among YLAI’s U.S.-based partners, 2024 Alumni, and local entrepreneurial communities across the Western Hemisphere. Through these substantive two-week projects, U.S. Participants will form lasting and productive partnerships with YLAI Alumni, expand markets and networks, and increase mutual understanding between the United States and LACC countries.

Eligibility for Outbound Exchange Program

• Successful applications will demonstrate a history of productive collaboration between the U.S. Participant (2024 Fellowship Placement Organization, FPO) and a 2024 YLAI Alum, and detail how the Award will be used to further the partnership, support inclusive economic prosperity in the region, and support the professional goals of the U.S. Participant and 2024 YLAI Alum.
• The Award requires the U.S. Participant to travel to the Alum’s country and engage with the local community.

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Eligible Countries for Outbound Exchange Program

Antigua and Barbuda, Argentina, Aruba, Bahamas, Barbados, Belize, Bolivia, Brazil, Canada, Chile, Colombia, Costa Rica, Cuba, Curacao, Dominica, Dominican Republic, Ecuador, El Salvador, Grenada, Guatemala, Guyana, Haiti, Honduras, Jamaica, Mexico, Nicaragua, Panama, Paraguay, Peru, St. Kitts and Nevis, St. Lucia, St. Vincent and the Grenadines, St. Maarten, Suriname, Trinidad and Tobago, Uruguay, Venezuela.

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Application

The application period closes on Tuesday, July 16 at 11:59 PM EDT.

• Download the following materials:
  • Application Checklist
  • Application Instructions
  • Draft Budget Template
  • Draft Work Plan
  • FAQ Document
  • Terms and Conditions Agreement
• Complete and submit your application here.

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